The selection of PCB solder mask ink requires comprehensive performance requirements, application scenarios and process adaptability. The core selection dimensions and methods are as follows:
1. Basic selection factors
(1) Curing method
✓Light curing type: UV curing, fast speed, energy saving, suitable for fine circuits (such as HDI boards), but high cost and strict storage conditions15.
✓Thermosetting type: Requires heating curing, stable process, low cost, suitable for conventional products, but high energy consumption.
(2) Color selection
Sheet（In the original article）
(3)Performance level
✓Ordinary type: Meets basic insulation and wear resistance requirements, suitable for consumer electronics (mobile phones/computers).
✓High performance type: High temperature resistance (＞260℃), flame retardant (UL94V-0), antistatic, suitable for military/medical/automotive electronics.
2. Key performance parameters
2-1.Physical properties
✓Viscosity : The solder mask ink is controlled at 120-150Pa·s (25℃), and the thixotropy needs to reach 30%-50% (the viscosity decreases after stirring, which is conducive to screen printing).
✓Thickness : Meet the IPC-SM-840C standard (level 2 ≥10μm, level 3 ≥18μm), and the solder mask bridge spacing must be ≥3.5mil when the copper thickness is 2oz.
✓Fineness : Pigment particles ≤5μm to avoid screen clogging.
2-2.Special scene adaptation
✓High-frequency circuit (＞5GHz): Use low dielectric constant ink to avoid impedance deviation caused by ENIG process.
✓High-density design : The solder mask bridge spacing must be ≥2.5mil (industry standard in 2023), and the color ink needs a larger margin.
✓Environmental resistance : The chemical resistance needs to be enhanced in the wet and hot/chemical corrosion environment (such as polyurethane resin-based ink).
3. Application scenarios and process adaptation
Sheet（In the original article）
Summary: Green inks are given priority to ensure process maturity; special scenarios should be selected based on function (e.g. choose white for LEDs and use black with caution for high frequencies); high-performance types should be used unconditionally in the military/medical fields.
The full article source link is as follows: https://www.ft-ch.com/info/how-to-choose-pcb-solder-mask-ink-103038011.html
Fountain Technologies, has a strong process R&D team, and often gives customers the most valuable advice and suggestions on the selection of welding inks. As a professional PCB & PCBA service provider, we use the 6σ quality management system and flexible production model to ensure that each circuit board meets military-grade reliability standards.
Welocome to cpntact me for more details.
Whatsapp: +86 15016527033
Website: https://www.ft-ch.com/
Email: sales05@ft-ch.com
Erika Huang
How to choose PCB solder mask ink?#pcb#soldermask#ink #pcbmanufacter#China
The selection of PCB solder mask ink requires comprehensive performance requirements, application scenarios and process adaptability. The core selection dimensions and methods are as follows:
1. Basic selection factors
(1) Curing method
✓Light curing type: UV curing, fast speed, energy saving, suitable for fine circuits (such as HDI boards), but high cost and strict storage conditions15.
✓Thermosetting type: Requires heating curing, stable process, low cost, suitable for conventional products, but high energy consumption.
(2) Color selection
Sheet（In the original article）
(3)Performance level
✓Ordinary type: Meets basic insulation and wear resistance requirements, suitable for consumer electronics (mobile phones/computers).
✓High performance type: High temperature resistance (＞260℃), flame retardant (UL94V-0), antistatic, suitable for military/medical/automotive electronics.
2. Key performance parameters
2-1.Physical properties
✓Viscosity : The solder mask ink is controlled at 120-150Pa·s (25℃), and the thixotropy needs to reach 30%-50% (the viscosity decreases after stirring, which is conducive to screen printing).
✓Thickness : Meet the IPC-SM-840C standard (level 2 ≥10μm, level 3 ≥18μm), and the solder mask bridge spacing must be ≥3.5mil when the copper thickness is 2oz.
✓Fineness : Pigment particles ≤5μm to avoid screen clogging.
2-2.Special scene adaptation
✓High-frequency circuit (＞5GHz): Use low dielectric constant ink to avoid impedance deviation caused by ENIG process.
✓High-density design : The solder mask bridge spacing must be ≥2.5mil (industry standard in 2023), and the color ink needs a larger margin.
✓Environmental resistance : The chemical resistance needs to be enhanced in the wet and hot/chemical corrosion environment (such as polyurethane resin-based ink).
3. Application scenarios and process adaptation
Sheet（In the original article）
Summary: Green inks are given priority to ensure process maturity; special scenarios should be selected based on function (e.g. choose white for LEDs and use black with caution for high frequencies); high-performance types should be used unconditionally in the military/medical fields.
The full article source link is as follows: https://www.ft-ch.com/info/how-to-choose-pcb-solder-mask-ink-103038011.html
Fountain Technologies, has a strong process R&D team, and often gives customers the most valuable advice and suggestions on the selection of welding inks. As a professional PCB & PCBA service provider, we use the 6σ quality management system and flexible production model to ensure that each circuit board meets military-grade reliability standards.
Welocome to cpntact me for more details.
Whatsapp: +86 15016527033
Website: https://www.ft-ch.com/
Email: sales05@ft-ch.com
1 year ago (edited) | [YT] | 1
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